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Wire Bonder WB200


Semi-automatic wire bonder equipment for ball, wedge and bump,
Motorized X, Y and Z axis,
Color touch screen,
Used with 17 to 50 µm wire,
Quick and easy programming menu,
R&D and productions applications.
Options :
Heated workholder, Pivoting workholder up to 90°,
Side inspection camera with screen, ...


View with the side inspection camera option :



Download the data sheet WB200:
+33(0)4 90 40 60 90
+33(0)4 90 40 61 05 (FAX)



ZA la Garrigue du Rameyron
84830 Serignan-Du-Comtat
FRANCE
Lun-Ven : 08h30 - 17h00
microtest@microtest-semi.com

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