Menu principal :
An Innovative Process applies a gaseous passivationthat delay the re oxidation of the metallic surfaces.Simple, Effective and Safe Process :
• Simple process no vacuum chamber.
• Fast completes in a few minutes.
• Downstream radical chemistry only.
• Ultra clean no particle adders or contamination.
• Safe for devices and personnel :
• No arc discharges, ions, bombardment.
• Re deposition, or spalling particles.
• CMOS safe, compound semiconductor safe.
• Non-toxic, dry process. OSHA and EPA friendly.
• CE Mark (third party inspection).
• Easy Installation : 120-240V / 50-60Hz Power, Process Gases, House vacuum, exhaust.